TAP Engineering is a rapid-response hardware engineering firm founded in 2020, specializing in the Defense and Intelligence Community. The company focuses on turn-key electronic product development, reverse engineering, and microelectronics hardware trust. With a commitment to excellence, TAP Engineering engages in research and development in areas such as additive manufacturing and quantum computing, providing innovative electronics solutions across various defense-related platforms.
February 17
TAP Engineering is a rapid-response hardware engineering firm founded in 2020, specializing in the Defense and Intelligence Community. The company focuses on turn-key electronic product development, reverse engineering, and microelectronics hardware trust. With a commitment to excellence, TAP Engineering engages in research and development in areas such as additive manufacturing and quantum computing, providing innovative electronics solutions across various defense-related platforms.
β’ TAP is seeking to hire a Principal Microelectronics Engineer to join our team! β’ The Principal Microelectronics Engineer will be working alongside the Department of Commerce National Institute of Standards and Technology (DOC NIST) in planning and executing microelectronics programs related to the CHIPS and Science Act. β’ The successful candidate will work closely with a small team of interdisciplinary, inter-agency technical subject matter experts (SMEs) and program managers in collaboration with industry and academia to strengthen the domestic microelectronics supply chain. β’ The Principal Microelectronics Engineer will work to shape, write, release, assess, and award industry Notice of Funding Opportunities (NOFOs). β’ And, once awarded, they will support the execution and management of the resulting programs (managing scope, cost, schedule, risk, resources, etc.). β’ This position requires an individual with both technical and program management skills.
β’ U.S. Citizenship β’ Ability and willingness to obtain a Public Trust clearance. β’ Bachelors Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Computer Science or related technical discipline. β’ 10+ years of experience β’ A relevant Masters Degree may be substituted for 2 years of experience (MS w/ 8+ years) β’ A relevant PhD Degree may be substituted for 4 years of experience (PhD w/ 6+ years) β’ Excellent verbal and written communication skills. β’ This position requires the ability to brief senior-level executives within the government, industry and academia. β’ The successful candidate will have the ability to write and review technical documents. β’ Microelectronics hardware subject matter expertise in at least one of the areas listed below: Materials & Substrates, Equipment, Tools & Processing, Power Delivery & Thermal Management, Connectors & Photonics, Codesign & EDA, Chiplets
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