Boschman Advanced Packaging Technology is a high-tech Dutch company specializing in innovative packaging solutions. Offering a comprehensive end-to-end service, Boschman supports clients throughout the entire process of package design, assembly, sintering, and molding equipment needs. The company is known for its advanced technologies such as Ag-Sintering, Film Assisted Molding (FAM), Dynamic Insert Technology (DIT), and Through Polymer Via (TPV). Boschman serves a variety of industries, including automotive, medical, avionics, mobile, industrial & renewables, by providing equipment and services that range from small series sampling to advanced package production and high-quality manufacturing.
Package Development • Ag Sintering • Transfer Molding • MEMS & Sensors • Power Modules
December 12, 2024
Join Boschman as a Service Engineer installing and maintaining advanced packaging machines.
December 1, 2024
Join Boschman as a Service Engineer, installing and maintaining cutting-edge semiconductor technologies.