Product Integration Platform
11 - 50
π₯ Funding within the last year
π° $3.5M Seed Round on 2023-11
March 19
11 - 50
πΊπΈ United States β Remote
π₯ Funding within the last year
π° $3.5M Seed Round on 2023-11
β° Full Time
π‘ Mid-level
π Senior
π Backend Engineer